Sangam: A Confluence of Knowledge Streams

A wafer mapping technique for residual stress in surface micromachined films

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dc.contributor EPSRC - Engineering and Physical Sciences Research Council
dc.contributor Walton, Anthony
dc.creator Schiavone, Giuseppe
dc.creator Murray, Jeremy
dc.date 2016-06-10T15:33:40Z
dc.date 2016-08-01T04:15:28Z
dc.date.accessioned 2023-02-17T20:53:15Z
dc.date.available 2023-02-17T20:53:15Z
dc.identifier Schiavone, Giuseppe; Murray, Jeremy. (2016). A wafer mapping technique for residual stress in surface micromachined films, [dataset]. University of Edinburgh. School of Engineering. https://doi.org/10.7488/ds/1424.
dc.identifier https://hdl.handle.net/10283/2030
dc.identifier https://doi.org/10.7488/ds/1424
dc.identifier.uri http://localhost:8080/xmlui/handle/CUHPOERS/244094
dc.description Data supporting a forthcoming publication.
dc.format application/vnd.openxmlformats-officedocument.spreadsheetml.sheet
dc.language eng
dc.publisher University of Edinburgh. School of Engineering
dc.relation Schiavone G et al (Accepted) IOP Journal of Micromechanics and Microengineering
dc.rights Creative Commons Attribution 4.0 International Public License
dc.title A wafer mapping technique for residual stress in surface micromachined films
dc.type dataset


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